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BGA balls are typically formed on a semiconductor device and provided with a solder material on an opposite side thereof, so that they can be bonded to conductors on a system board through reflowing the solder material. The solder material, however, is subject to oxidation, and a great deal of care must be taken to avoid oxidation of the solder material.
Some semiconductor devices include solder interconnections for making such electrical connections. However, such solder interconnections can be subject to oxidation and can have reliability problems.
The present inventors have recognized these needs and others, and provide embodiments of interposers to overcome these and other deficiencies.The prelingual hearing loss causes multiple difficulties for the affected individual and their family. First, it can create stress in the family and community. Second, it can have a negative impact on the child, leading to behavior problems, which often require additional educational and/or occupational services from the educational and occupational service system. Third, it can be associated with emotional and psychosocial problems and diminished